TSMC Unveils A14 Process, Launches 1.4nm Chips by 2028

TSMC has unveiled its next-generation A14 chip manufacturing process, a 1.4-nanometer technology set to enter mass production in 2028, promising significant advancements in computing speed, power efficiency, and logic density. The A14 process is projected to deliver up to a 15% speed increase or a 30% reduction in power consumption compared to its N2 technology, alongside a more than 20% boost in logic density. Unlike some competitors such as Intel, TSMC will skip the adoption of High-NA EUV lithography for A14, opting for a cost-efficient approach using conventional 0.33-NA EUV technology. The company’s NanoFlex Pro standard cell architecture and advanced Chip on Wafer on Substrate (CoWoS) technology will further support the growing demand for high-performance AI and computing chips. TSMC's roadmap includes launching its A16 process in 2026 and ongoing enhancements to its packaging and integration capabilities to meet surging industry demand. Major clients like Apple, NVIDIA, and AMD are expected to benefit from these innovations as semiconductor industry revenues continue to climb.